Transitioning from Preventable
to Pervasive Defectivity in Semiconductor Manufacturing
This white paper presents the need for material suppliers, equipment makers, fabs, and semiconductor customers to share insights to achieve the most effective, holistic contamination control performance that addresses both the defects we can see and those we have yet to see.
This case-study approach will demonstrate solutions to contamination challenges that:
- Threaten wafer yield
- IC performance
- Device reliability
Wafer map signatures to determine the root cause of the maverick yield event.