Photochemical Delivery that Meets the Challenges of 3D Architecture
pump it up
Advanced node technology requiring finer geometries has pushed lithography to its very limits. Now more than ever, the finer geometries and vertical structures are impacted by chemical impurities. Defects caused by particle contamination from specialty chemistries like polyimides and photoresists adversely impact final device yields.
While particles are a primary concern, bubbles in photochemicals can also create anomalies in the resulting films that later lead to pattern failure.
Let’s look at why:
- Bubbles smaller than 100 μm can be completely dissolved into the photoresist.
- Larger diameter bubbles (typically >300 μm diameter), cannot be fully adsorbed by the resist and these bubbles can remain even after one hour.
- Sensing bubbles of this size has become a critical challenge within lithography processes.
This paper provides a close look at how to maintain purity and prevent photolithography defects during photochemical delivery onto the wafer through clean, chemical delivery pumps.
To meet the needs of the changing lithography landscape, fluid pump technology must have powerful dispense capabilities to handle viscosities ranging from 1 to over 4000 cP. Matching the right dispense technology to the viscosity is an important part of optimizing the process to reduce defectivity.
