Polishing of Chemically Inert and Mechanically Hard Materials
New materials are constantly being introduced into semiconductor manufacturing to achieve higher integration levels, unique functionalities, and enhanced performance.
A significant number of new materials are mechanically hard and/or chemically inert (e.g., silicon carbide, gallium nitride, amorphous carbon, inert metals such as ruthenium, molybdenum, etc.).
Because these materials are chemically inert and mechanically hard, the chemical mechanical polishing (CMP) polishing rates are relatively much slower than traditional materials that are currently employed in the industry (e.g., copper, tungsten, silica, silicon nitride etc.). Thus, new CMP techniques have to be developed to address these challenges.
In this webinar, Dr. Rajiv Singh, VP, CMP slurries, addresses methods to achieve high polish rates and enhanced surface finish in silicon carbide, gallium nitride, sapphire, and carbon-based materials.
About the Presenter:
Dr. Rajiv Singh is the VP of CMP slurries at Entegris since Jan 2020. His area of expertise is advanced semiconductor processing, including chemical mechanical polishing and innovative processing of next generation materials. After earning his Ph.D from NC State University in 1990, and prior to joining Entegris, he was the Professor of Materials Science and Engineering at the University of Florida for 30 years (1990 -2020).
In 2002, Dr. Rajiv Singh founded Sinmat to focus on innovation and commercialization of CMP slurries and helped Sinmat become the global leader in CMP slurries of hard materials. He has published over 500 papers (H index of 55), filed/awarded over 40 patents, and graduated over 50 Ph.Ds in semiconductor processing. He is the fellow of six International Technical Societies (IEEE, MRS, APS, ECS, ASM and AAAS) and winner of four R&D 100 awards for developing innovative CMP slurries for polishing metals and dielectrics.