Materials Innovation: Holistic Solutions for Improved Yield and Reliability

New trends in IoT and smart devices, industrial automation and autonomous vehicles, AR and VR, 5G communication and AI, are pushing the limits of data storage and data processing. 

Join Entegris’ SVP, CTO, Jim O’Neill in this webinar to learn about:

  • Digital transformation and the demand for higher performance chips
  • New, purer materials needed to deliver high-yield and long-term reliability
  • Holistic materials and handling solutions to enable a new approach to the most challenging yield problems of advanced node technologies. 

Learn more about Materials Innovation: Holistic Approach to Enabling Device Performance, Yield, and Reliability

About the Presenter:

Dr. James A. O’Neill serves as the SVP & Chief Technology Officer for Entegris.

In this capacity, he is responsible for the innovation process within the company including the development of new products and the laboratories that support them around the world. 

James joined Entegris in 2012 as Senior Vice President responsible for the electronic materials business in the former ATMI division. Prior to joining Entegris, he held several technical and leadership roles at IBM Microelectronics where his last role was director of 14 nm technology development activities at both Albany Nanotech and East Fishkill facilities.

With over 30 years of experience in research, development, and manufacturing operations for the semiconductor industry, James now leads global development efforts in new material solutions for the industry’s most complex technology and manufacturing challenges.

O’Neill earned a Ph.D. in physical chemistry at Columbia University and a Bachelor’s degree in chemistry from Yale University.

Jim O_Neill