SEMICON West 2019 | North Hall | Booth 6353
Entegris is excited to participate in SEMICON West 2019, the event that connects the entire extended electronics supply chain in one place at one time. Learn more about our advanced solutions by requesting event-related content.
Considerations for Improving 3D NAND Performance, Reliability, and Yield
Three-dimensional vertically-stacked memory architectures offer exponential gains in flash memory storage, but they also introduce fundamental new challenges at the device fabrication and integration level. Take a closer look at the unique challenges of 3D NAND design and manufacturing, and considerations for overcoming them.
96 Layers and Beyond: Solving 3D NAND Material and Integration Challenges
Decades-old practices are no longer effective when increasing the number of 3D NAND structures to 96 layers and beyond. Improvements in materials and process integration will enable high-yielding 3D NAND structures to support the ever-increasing device storage needs. Contamination and material purity are more important than ever as device scaling continues.
Reducing Contamination and Improving Yield: Precision Engineered Techniques for Coating Plasma Chamber Components
Learn about the importance of precision-engineered coatings for etch chamber components that can help reduce contamination risk and produce higher-yielding semiconductor devices.
The Small, Medium, and Large of Preventing Automotive Latent Defects
Learn about our advanced chemical filtration and purification solutions in the semiconductor fab and how they help prevent hidden defects.
Chasing the Perfect Pattern
Semiconductor fabricators need to prevent photolithography pattern flaws to ensure the functionality and reliability of their electronics devices. Check out how they’re doing it.
Clean Chemical Delivery
Reducing Contamination Points in Clean Chemical Delivery from Manufacture through
Point of Use
To achieve optimum wafer yield and reliability, the microelectronics industry needs to address the increased materials consumption requirements and material purity challenges from chemical manufacture to point-of-use.
Ensuring Purity and Safety: How to Select the Right Container System for Safe, Clean Chemical Delivery
Learn why choosing a reliable single-sourced solution provider of contamination-controlled chemical packaging, with a proven understanding of fluoropolymer processing, and expertise in how to control potential contamination sources, is the most efficient and cost-effective way to mitigate both contamination and safety risks when storing, transporting, or dispensing bulk chemicals.
End to End Gas Purity
Bowling for Contaminants: The New Science of Gas Purification
Semiconductor device yields have long been impacted by contamination. Gas purity must extend through the full supply chain to prevent process excursions and improve device performance and reliability.
EUV: Advanced Lithography
Enabling Advanced Lithography: The Challenges of Storing and Transporting EUV Reticles
Extreme ultraviolet (EUV) lithography is expanding into high-volume production as the semiconductor industry continues to push the envelope of ever-shrinking design dimensions. EUV lithography is an enabling technology for streamlining the patterning process.
Glass Alternatives: Clean Chemical Delivery
Exploring Glass Container Alternatives for Clean Chemical Delivery
Learn about the challenges posed by relying on traditional glass bottles to pack, store, ship, and deliver clean process chemicals, alternatives and a viable solution to these challenges.
Global Operational Excellence
Building a Reliable and Predictable Specialty Chemicals Supply Chain for Semiconductor Manufacturing Success
Let's examine the technology advancements required to support advanced node manufacturers, and the role the advanced materials supply chain plays in supporting new opportunities and solving challenges to help semiconductor manufacturers remain competitive.
The Internet of Things: A Sustainable Driver for Integrated Circuit Growth
From smart speakers to smart homes, smart cities, smart transportation, smart pharmaceuticals, and smart grids, it is not hard to imagine a world where there are chips in just about everything.
Materials Integration for Scaled Devices
Exploring the Possibilities: A Holistic Approach to Materials Processing for Scaled Devices
As the industry progresses beyond the 7 nm process node, and the need for changes in device architecture, feature dimensions, process materials, and fabrication equipment to achieve production goals, issues of scaling logic devices are emerging.
Silicon Precursor Toolbox for Low-temperature Deposition
The drive toward making electronics faster, denser, and cheaper continues unabated. Shrinking device dimensions and changes in structure place additional demands on the materials used in all steps of semiconductor processing.
Total Container Solutions
Realizing Bottom Line Profits from Wafer Carrier Selection
Protect your investment with full container solutions to monitor, protect, transport, and deliver those valuable wafers from the front-end through to the back-end of the fab.