SEMICON Korea 2021 Content
VIRTUAL EVENT
Learn more about our advanced solutions by requesting event-related content.
FINDING THE SWEET SPOT IN Storage Class Memory
Pictorial explaining how phase-change materials can play an increasingly important role in storage class memory (SCM), and how our technology can help enable low-cost and high-performance memory technologies.
HOLISTIC APPROACH TO ENABLING DEVICE PERFORMANCE, YIELD AND RELIABILITY
Pictorial explaining how we impact processes across the fabrication floor. Whether it is new metallurgy precursors, effective delivery systems, new cleaning formulations, or new filtration membranes.
SHOCK TO THE SYSTEM: DEFENDING AGAINST DANGEROUS ELECTROSTATIC DISCHARGE
Pictorial of the dangers of static charge accumulation and harmful electrostatic discharge in PFA fluid handling systems, and our solution to overcome the many challenges presented by electrostatic hazards.
BEGINNING TO END WAFER HANDLING SOLUTIONS
Protect your investment with full container solutions to monitor, protect, transport, and deliver those valuable wafers from the front-end through to the back-end of the fab.
EXPLORING GLASS ALTERNATIVES FOR CLEAN CHEMICAL DELIVERY
As device feature sizes become finer, new root causes for device defects are being traced to glass bottles. That, combined with increasing concern over safety as fabs become larger and more automated, has sparked the industry to develop glass container alternatives.
CLEAN CHEMICAL DELIVERY
To achieve optimum wafer yield and reliability, the microelectronics industry needs to address the increased materials consumption requirements and material purity challenges from chemical manufacture to point-of-use.
SAFE, CLEAN CHEMICAL DELIVERY: PURITY AND SAFETY
To ensure a consistent chemical supply that meets the highest purity requirements of the semiconductor industry, look to our end-to-end chemical handling, transport, and delivery system solutions that satisfy regulatory requirements for purity and safety.
END TO END GAS PURITY
Semiconductor device yields have long been impacted by contamination — the sensitivity to contamination during manufacturing processes has increased significantly. Gas purity must extend through the full supply chain to prevent process excursions and improve device performance and reliability.
GAS FILTRATION SOLUTIONS
Eliminating the contaminants in your process is most sensitive and begins by taking a holistic view of the gas delivery path.
CHASING THE PERFECT PATTERN
Semiconductor fabricators need to prevent photolithography pattern flaws to ensure the functionality and reliability of their electronics devices. Check out how they’re doing it.
FILTRATION FACTS AND FICTION
Learn how to use the "Lithographer's Toolkit" to select the optimal solution to reduce the variations that degrade the performance of photolithography processes.
3D NAND: 96 LAYERS AND BEYOND
Three-dimensional vertically-stacked memory architectures offer exponential gains in flash memory storage, but they also introduce fundamental new challenges at the device fabrication and integration level.These challenges affect all aspects of the flash memory production chain, from design to supply to material handling, manufacturing, and delivery.
Advanced Coatings
New materials and processes are required to ensure reliability at high volumes. This places new burdens on the cleanliness of etch and deposition chambers, to avoid yield loss and maintain consistent results for each wafer.
Advanced Deposition Materials
Through close collaboration with chip and tool manufacturers, we develop and test candidate precursors for the next generation films, devices, and process requirements taking a holistic approach to advanced material development, yielding industry-leading innovation.
Silicon Precursor Toolbox
A toolbox approach to choosing the most appropriate precursor and plasma combination for a given application making process development more efficient, benefiting semiconductor device manufacturers and their customers.
SPI Innovative Materials
Solving Advanced Technology Challenges with Innovative Materials: Solutions for surface preparation and integration