ALD / AVS 2019 | Atomic Layer Deposition | Atomic Layer Etching Workshop
Entegris pleased to be a sponsor of the AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019).
Considerations for Improving 3D NAND Performance, Reliability, and Yield
Three-dimensional vertically-stacked memory architectures offer exponential gains in flash memory storage, but they also introduce fundamental new challenges at the device fabrication and integration level. Take a closer look at the unique challenges of 3D NAND design and manufacturing, and considerations for overcoming them.
96 Layers and Beyond: Solving 3D NAND Material and Integration Challenges
Three-dimensional vertically-stacked memory architectures offer exponential gains in flash memory storage, but they also introduce fundamental new challenges at the device fabrication and integration level.
Reducing Contamination and Improving Yield: Precision Engineered Techniques for Coating Plasma Chamber Components
Learn about the importance of precision-engineered coatings for etch chamber components that can help reduce contamination risk and produce higher-yielding semiconductor devices.
Materials Integration for Scaled Devices
Exploring the Possibilities: A Holistic Approach to Materials Processing for Scaled Devices
As the industry progresses beyond the 7 nm process node, and the need for changes in device architecture, feature dimensions, process materials, and fabrication equipment to achieve production goals, issues of scaling logic devices are emerging.
Silicon Precursor Toolbox for Low-temperature Deposition
The drive toward making electronics faster, denser, and cheaper continues unabated. Shrinking device dimensions and changes in structure place additional demands on the materials used in all steps of semiconductor processing.