The need for smaller dimensions and increasing device performance requirements are driving the move to new metals for advanced logic and memory. The industry is evaluating lower-resistance and barrierless material alternatives. Molybdenum (Mo), ruthenium (Ru), or cobalt (Co) will soon become standard when producing state-of-the-art devices. 

The transition to Mo or another new metal will not be easy, and IDMs need to accelerate speed-to-yield to run a high-purity process as quickly as possible. 

Choosing an experienced supplier that offers high-purity materials for multiple process steps helps avoid unnecessary challenges, obstacles, and risks. This option smooths the path to high-volume production with higher yields and quality.