Advancing CMP Performance Across Advanced Semiconductor Applications
An Entegris Technology Day
THURSDAY, OCTOBER 8, 2026
8:30 AM - 1:30 PM CET (Including networking lunch)
Gebäude Werkstätten Hellerau | Dresden, Germany
FREE - Registration required as space is limited.
Join Entegris for a Morning of CMP Innovation
Chemical Mechanical Planarization (CMP) remains essential to enabling advanced semiconductor manufacturing. As device architectures evolve toward advanced packaging, 3D integration, and heterogeneous systems, manufacturers face growing challenges in defectivity control, process stability, yield improvement, and sustainability.
Join Entegris experts for a focused morning dedicated to the latest advances in CMP solutions - slurries, pads, filtration, process monitoring, and advanced packaging applications.
We are also pleased to welcome CEA-Leti, which will share recent work on die-to-wafer CMP consumable set evaluation for advanced packaging applications, demonstrating the value of industry and research collaboration in accelerating innovation and industrial transfer.
Designed as a half-day event, this Technology Day allows you to gain valuable technical insights, and network with peers and experts over lunch.
Why Attend?
- Learn about the latest CMP innovations are enabling advanced packaging and 3D integration.
- Discover next-generation slurry and pad technologies that improve planarization performance and reduce defects.
- Explore real-time monitoring and advanced filtration strategies that strengthen yield, process control and consistency.
- Understand sustainability initiatives, including consumable lifetime extension and CMP pad circularity.
- Gain practical insights from Entegris and CEA-Leti on consumable optimization for advanced packaging applications.
