CMP Technology Day

Maritim HOTEL & CONGRESS CENTER | Dresden, Germany

June 29, 2023

Entegris is pleased to invite you to attend in-person a technology day focusing on Chemical Mechanical Planarization (CMP), one of the most critical applications in chip manufacturing.

Take this unique opportunity to join us on June 29 and collaborate with our experts on your challenges.

9:30 Registration and Welcome Coffee
10:00 Entegris Today - A New Collaborative Approach
Antoine Amade - President EMEA Region

Accelerated Time to Yield with Entegris End-to-End CMP Solutions
Ankur Desai - Strategic Accounts Director for Intel and Sales Director for VCS North America/EMEA

10:25 LFoundry and Entegris: A Success Story of Collaboration
Girolamo Penso - CMP Manager at LFoundry
10:55 Break
11:10 See the Positive Difference of the New D92XX Slurry Line
Federico Barbieri - Sr. Customer Technology Engineer EMEA for CMP
11:35 Time to Change Your CMP Pad? Discover the Benefits of a Different Technology
Mario Stella - Sr. CTE Manager EMEA
12:00 Networking Lunch sponsored by Entegris
13:30 Enabling 2.5D/3D IC Heterogeneous Integration and More than Moore Chiplet Scaling with Through-Silicon via, Hybrid Bonding Copper, and Die-Isolation Dielectrics CMP Solutions
Jim Hsu - Director of CMP Technologies
14:05 Real-Time Concentration Measurements for Efficient Process Control
Phillipp Lehmann - Field Applications Engineer EMEA
14:25 Joining Forces in R&D – An Introduction to Our Collaboration Efforts to Improve Defectivity in CMP
Clément Castan - R&D Chemical Mechanical Planarization Engineer at CETI-Leti
14:55 Break
15:15 Enhance Your Process by Advanced Slurry Filtration
Günter Haas, Ph.D. - Field Application Engineer | Liquid Microcontamination Control
15:35 Complete Slurry Lifecycle LPCs Monitoring and Control with Accusizer® Lab and Online Tools 
Cyril Tô - Sr. Account Manager | Instrumentation
15:55 Wrap Up