ON-DEMAND WEBINAR | Challenges in Scaling SiC Power Chip Manufacturing: A Material Supplier's Perspective
The era of silicon carbide (SiC) based power chips has started. Factories are accelerating production of substrates and chips to meet current demand. However, considering that these chips are designed to enhance end-use efficiency, it’s worth considering the SiC chipmaking process. Is it also efficient?
Here’s the answer: not yet. But that should not be surprising, as high volumes have not been in operation long enough to resolve early-stage issues. In this webinar, we will touch on some of the areas where SiC material properties present chip makers with continuing challenges. These challenges are at varying levels of resolution and will no doubt be solved in time. This resolution will enable SiC power chips to take their predicted place in the future ecosystem.
REGISTER TO GET INSIGHTS ON
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Chemical Mechanical Planarization (CMP): SiC is harder than Si. How can we achieve a high removal rate?
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Handling: SiC is more brittle than Si. How can we prevent damage or breakage of SiC wafers?
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Implantation: SiC is more difficult to implant than Si. How can we increase source lifetime?
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Thermal Processing for Wafer Growth and Epitaxy Processes: SiC processes run hotter than Si. How can we manage chamber components for better cost efficiency?
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Sustainability: How can we improve slurry recycling and wastewater management?
ABOUT THE SPEAKERS
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Joe Despres |
Manny Gonzales |
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Jorgen Lundgren |
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 Pankaj SinghDirector, R&D AMM Substrates & Specialty Materials |
