Advanced CMP of Silicon Carbide for EVs and Power ICs


The transition from gas-powered to electric vehicles (EVs) is happening at a faster rate than predicted. Batteries are also operating at higher voltages.

These trends put pressure on power integrated circuit (IC) manufacturers to produce higher volumes of chips using technologies designed to withstand high-temperature, high-frequency operating environments. Part of the answer lies in transitioning from silicon substrates to silicon carbide (SiC) and gallium nitride (GaN).

The first steps in fabricating SiC wafers involve grinding, lapping, and polishing the wafers to create the necessary surface properties before depositing active layers. The slurries used to carry out these steps, therefore, are becoming more critical.

In this webinar, you will learn about:

  • The challenges specific to SiC polishing process
  • Slurry performance improvement to address new technical challenges including increasing removal throughput, eliminating scratches, and low cost of ownership
  • The benefits of offering an encompassing synergetic solution to improve yield

About the Presenter:

Fadi Coder | Director, global applications

Fadi Coder-1Fadi Coder joined Entegris in 2014 as the global applications director for the Surface Preparation and Integration business unit, where he leads the advance technology engagements team for wet etch, plating, and CMP applications. For more than 27 years, Fadi has held various technical and product management positions in the semiconductor equipment and materials industry. Fadi completed his undergraduate and graduate degrees in electrical engineering.